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DP07-K00-0085
- Product Type： Shielding cover
- Material： Nickel silver
- Height： 1.10mm
Category:
Shielding cover
Keyword： DP07-K00-0085
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Product Description
Category
Parameter item
Material Properties
Copper alloy substrate, material thickness 0.15 ± 0.02 mm
Product Features
Cupronickel substrate, excellent electrical and thermal conductivity, outstanding EMI electromagnetic shielding performance.
With a height of only 1.10 mm, its ultra-thin, low-profile design is ideal for compact internal stacking.
Custom-shaped contours, precisely tailored to meet PCB component placement and clearance requirements.
Snap‑on structural design, paired with a shielding clip for easy installation and support for disassembly and maintenance.
Integrated precision stamping with high dimensional accuracy and excellent batch-to-batch consistency.
Corrosion- and oxidation-resistant, with stable and reliable shielding performance over long-term use.
Environmental requirements
Meets the requirements of the RoHS 2.0 environmental directive.
Packaging method
Tape-and-reel packaging
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3D display
1st Floor, Zone B, Wanhe Pharmaceutical Park, Yuehai Subdistrict, Nanshan District, Shenzhen, Guangdong Province, China
Jingrui Technology Building, 100 meters north of the intersection of Industrial North Road and Xiangshi Road, Songshan Lake High-tech Industrial Development Zone, Dongguan, China
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