S0HG-150008-08G
- Booth Series: SIM card slot
- Card Retrieval Methods: Lift-up lid type
- Hot-swap: Not supported
- Positioning Pins: None
Category:
SIM card slot
Keyword: S0HG-150008-08G
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Product Description
Category
Parameter item
Specification Metrics
Material
Plastic casing
LCP E130i, flame retardancy rating UL94 V-0
Terminal
C5210R-H tin-phosphor bronze, material thickness 0.15 mm
Shell
SUS304-H stainless steel, material thickness 0.12 mm
Electrical Characteristics
Rated current
1A
Dielectric withstand voltage
500V AC
Contact resistance
Maximum value: 30 milliohms
Insulation resistance
Minimum value: 1,000 megohms
Mechanical properties
Board height
1.50mm
Number of contacts
6
Poka-yoke design
Poka-yoke
Anti-collapse design
Not afraid of collapse
Lifespan
3,000 times
Environmental characteristics
Operating temperature
-25℃ ~ +70℃
Environmental requirements
RoHS-compliant and environmentally friendly
Surface treatment
Electroplating specifications
Surface G/F (flash gold plating) in the contact area
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3D display
3D display
1st Floor, Zone B, Wanhe Pharmaceutical Park, Yuehai Subdistrict, Nanshan District, Shenzhen, Guangdong Province, China
Jingrui Technology Building, 100 meters north of the intersection of Industrial North Road and Xiangshi Road, Songshan Lake High-tech Industrial Development Zone, Dongguan, China
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