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TSP38-130002-S1
- Booth Series： SIM & T-Flash Combo Card Slot
- Card Retrieval Methods： Thimble card remover
- Hot-swap： Support
- Positioning Pins： None
Category:
SIM & TF Combo Card Slot
Keyword： TSP38-130002-S1
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Product Description
Category
Parameter item
Specification Metrics
Material
Base
LCP MG350
Shell
SUS301-H, material thickness 0.12 mm
Detecting the firing pin
SUS301-H, material thickness 0.12 mm
Push-pull toggle lever
SUS304-H, material thickness 0.50 mm
Ejector pin
SUS304-1/2H, material thickness 0.40 mm
Electrical Characteristics
Rated current
0.3A PIN
Dielectric withstand voltage
500V AC
Rated voltage
10V DC
Contact resistance
Maximum value: 50 milliohms
Insulation resistance
Minimum 1,000 megohms
Mechanical properties
Height
1.35mm
Anti-collapse design
Anti-collapse
Combined form (split type)
Choose three out of three
Lifespan
3,000 times
Environmental characteristics
Operating temperature
-
Maximum ambient humidity
-
Environmental requirements
RoHS-compliant and environmentally friendly
Surface treatment
Electroplating specifications
Surface G/F (flash gold plating) in the contact area
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3D display
1st Floor, Zone B, Wanhe Pharmaceutical Park, Yuehai Subdistrict, Nanshan District, Shenzhen, Guangdong Province, China
Jingrui Technology Building, 100 meters north of the intersection of Industrial North Road and Xiangshi Road, Songshan Lake High-tech Industrial Development Zone, Dongguan, China
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