CPH01-04120101-01 Mixed-Insert Copper Post Clamp

• CPH01-04120101-01 Mixed-insert copper post clamp

In the context of smart wearable devices, precision modular medical components, and increasingly complex stacking architectures where internal space in miniature consumer electronics is severely constrained, traditional unidirectional docking connectors often limit the design flexibility of system engineers. To address this challenge, Krconn Technology Co., Ltd. has innovatively introduced a groundbreaking, ultra‑miniature, high‑reliability contact— Mixed-insert copper post clamp ( Model: CPH01-04120101-01 ). This product has now officially entered mass production. As a precision clip specifically designed to interface with Φ0.50mm charging copper posts, it seamlessly delivers multi‑axis insertion/extraction compatibility and flagship‑level solder‑bonding retention within an ultra‑compact footprint (1.90 mm wide × 1.60 mm high). Crafted from high‑strength, highly resilient SUS stainless steel, the product features finely engineered, layered gold (Au) plating in key contact and soldering zones—providing smart hardware with a cutting‑edge power and signal interconnect solution that offers exceptional flexibility, rock‑solid reliability, and ultra‑low impedance.

  I. New Product Technical Specifications (This mixed-insert copper post clamp incorporates multiple innovations by Krconn in microstructural mechanics, achieved through precision metal continuous molding in a single process; its core technological highlights include)

(1) Hybrid compatible design with side insertion and bottom insertion

The core breakthrough of this component lies in its unique spatial‑geometric bayonet mechanism. Whether inserted laterally, parallel to the motherboard (side‑insertion), or pressed in vertically from above (bottom‑insertion), it is fully compatible and connects seamlessly. This significantly frees up internal stacking space, allowing it to readily accommodate a wide variety of unconventional stack configurations and intricate internal wiring layouts.

           (2) DIP + SMT Hybrid Dual-Soldering Process

The product’s base innovatively adopts a hybrid board‑mount architecture that combines DIP (dual in-line package) and SMT (surface‑mount technology). The SMT portion delivers high‑efficiency, high‑speed automated component placement, while the vertical DIP pins penetrate deep into the motherboard layers. This powerful synergy ensures robust mechanical soldering integrity and superior peel resistance, effortlessly withstanding repeated, heavy‑duty plugging and unplugging cycles.

(3) Symmetrical and Reliable Contact Architecture with Dual Spring Contacts

The internal sides feature a highly symmetrical, precision‑engineered dual‑spring mechanism. When a Φ0.50 mm male copper post is slid axially into place, the left and right spring contacts deliver balanced, uniform opposing clamping force, ensuring comprehensive electrical and mechanical reliability of the contact interface and effectively preventing contact chatter or intermittent micro‑breaks.

(4) Automated Standard SMT Nozzle Pick-and-Place Area

The top of the product features a meticulously designed, flat automated pick‑up zone measuring 1.90 mm × 1.10 mm, compatible with the precision vacuum‑nozzle gripping capabilities of high‑speed, general‑purpose SMT placement machines. This ensures exceptionally high component‑placement yield and outstanding manufacturing efficiency on large‑scale industrial production lines.

II. Features and Advantages

(1) Excellent mechanical recovery and negligible permanent deformation

Through advanced CAE finite element simulation, even under an extreme interference fit of 0.65 mm, the clamping force in the X‑direction remains stable at 83 gf, while the resulting permanent plastic deformation is only 0.0025 mm (0.32%). This demonstrates that the component exhibits exceptionally excellent material fatigue‑induced elastic memory and long‑term resistance to relaxation.

(II) Precise Mechanical Plug-and-Play Simulation Verification  

Side‑insertion condition: When the compression reaches 0.136 mm, the maximum peak resistance attains 352.468 gf; upon full insertion (compression of 0.7 mm), the clamping retention force remains at 21.924 gf.

Insertion condition: When the compression reaches 0.301 mm, the peak maximum force is 293.690 gf; upon full insertion (at a compression of 0.7 mm), the final force stabilizes at 96.288 gf, thereby ensuring optimal tactile feedback and secure clamping during the insertion process.

(3) High‑specification stepped localized electroplating process

Contact area: A thick, 3 µin‑thick, highly wear‑resistant gold (Au) plating layer provides exceptionally low contact resistance and excellent chemical corrosion and oxidation resistance, ensuring more than 10 high‑ and low‑frequency clean‑mating cycles.

Soldering area: Electroplated with a 1 µin gold (Au) layer, and the bottom width is precisely tapered to 0.60 mm (complemented by a CH0.140 chamfer design), delivering exceptional solder paste wettability, superior lift‑off height, and perfectly filled solder joints.

(4) High-precision, ultra-thin substrate

Carefully selected industrial-grade, ultra‑flexible SUS stainless steel, with the core material thickness precisely controlled at an exceptional T = 0.10 ± 0.005 mm.

III. Target Market and Applications (This product, with its exceptionally high physical stack‑space utilization—featuring a buried‑pad and stepped‑soldering design, a solder‑area height of 2.00 mm, and a contact‑area protrusion of 1.30 mm—is ideally suited for the mid‑to‑high‑end electronics hardware market, where space constraints are stringent and quality stability is paramount.)

(1) Smart Hardware and Wearable Connectivity: TWS Bluetooth earphone charging case motherboard docking bay, and a smartwatch magnetic multi‑directional charging relay module.

(2) Highly Integrated Consumer Electronics: Ultra-thin, high-capacity power bank internal power cells with pin‑to‑pad connections; e‑cigarette internal heaters/battery contact terminals; and multi‑axis slip ring transition contacts for smart handheld gimbals.

(3) Precision Measurement and Instrumentation Module ： Internal PCB copper‑pillar‑level connectors for handheld cable locators, smart refractometers, and precision power‑monitoring modules.

IV. Product Parameters, Specifications, and Production & Supply Information